| Research and Development Team |
| Dr. Achyut K. Dutta |
| Dr. Dutta is the President and CTO of Banpil and is responsible for technology direction including the company's R&D activities, electrical and optical interconnection, sensor, and subsystems for various commercial system applications. He specializes in the design and development of high-speed modules, microwave design and simulation for microwave level interconnects, and various optical components. Prior to Banpil, Dr. Dutta held senior management and research positions at Fujitsu and NEC in the U.S. and Japan respectively. He was the Sr. Design Manager, Fujitsu, USA where he started high-speed module design center from scratch and successfully transferred the developed work to manufacturing in Japan and helped to generate >$350M revenues in 2000. At NEC, he was responsible for many projects and contributed in many optical components and subsystems for general and communication applications. Dr. Dutta has authored over 100 technical papers on optical devices, high-speed packaging, and opto-electronics interconnects, and holds 35 patents. He has also edited three books on WDM Technologies (Publisher: Academic Press, Boston, MA). He has been serving as organizer, general and conference chair, program chair, and technical program committee member of numerous conferences including SPIE, OSA, and IEEE. He is Fellow in SPIE and Sr. member in IEEE. Dr. Dutta was selected as one of three recipients for 1996 IEEE LEOS Engineering Achievement Award and NEC's best R&D award for POF-Link. Dr. Dutta received his MS and Ph.D. degrees both in Electronics Engineering from Shizuoka University, Japan. |
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| Robert Olah |
| Robert is VP of Engineering at Banpil. He brings more than 25 years of experience in technology development and management at various semiconductor companies. Most recently, Robert was the VP of Engineering at Lightspeed Semiconductor, responsible for next generation FPGA, state of the art IO with digitally controlled impedance, 1.6Gb/s differential interface for Hyper transport and 3.125 Gb/s SERDES development. Previously, he held key engineering management roles at I-Cube, Xilinx, Sierra, and VLSI. Robert's expertise is in circuit design of both analog and digital, CAD methodology and off chip high-speed interfaces. Robert holds 7 patents in circuit and process technology. He received his MSEE from the University of Minnesota. |
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| Dr. Nobuhiko Kobayashi |
| Dr. Kobayashi brings to Banpil more than 20 years of experience in technical management and research and development in the area of materials growth, sensor and optical device design, and fabrication. He specializes in designing and developing a variety of functional materials including group IV semiconductors (diamond, amorphous Si), group III-V compound semiconductors (III-Sb, III-As, III-P and III-N) and electronic oxides (Perovskite oxides, etc.). Dr. Kobayashi has been also extensively involved in developing various electronic and optoelectronic devices such as MOSFETs, MESFETs, Gunn / Schottky diodes, solar cells, visible~IR LEDs, edge-emitting diode lasers (980nm, 1550nm), VCSELs (850~1550nm), HBTs, optical amplifiers, optical modulators, arrayed waveguides. His expertise also covers synthesizing and characterizing nano-scale structures such as semiconductor quantum dots / wires and carbon nano-tubes. Prior to his present position, he was a senior scientist at the Center for Micro and Nano Technologies at Lawrence Livermore National Laboratory (LLNL, Livermore, California) where he was managing a DARPA project, with collaboration with University of California, Davis, on Optical Code Division Multiple Access. He was an also managing two LLNL's laboratory directed research program for which he was developing various functional materials for novel sensor applications such as radiation and bio/chemical sensors. Prior to LLNL, Dr. Kobayashi was at Agilent Laboratories/Hewlett-Packard Laboratories at Palo-Alto, California, and Honda Research and Development Co. Ltd. and Toshiba Corp., in Japan. Dr. Kobayashi has authored over 50 technical papers, a book chapter in the field of crystal growth / nanostructures and holds several patents. |
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| Dr. Saif Islam |
Dr. Islam brings to Banpil more than 10 years of R&D experience in the area of optical components and sensing device design, fabrication and testing. Dr. Islam's work has covered a broad variety of topics: molecular electronic devices, synthesis and device applications of semiconductor nanowires, ultra-fast optoelectronic devices, high-power and linear gain-clamped semiconductor optical amplifiers, fiber optical communication systems, and RF photonic devices and links. He was the first to demonstrate the velocity-matched distributed balanced photodetectors with a record high linear photocurrents and an ultra-fast response. He also worked on the first demonstration of ultra-fast resonant cavity enhanced (RCE) Schottky photodiodes. At Hewlett-Packard Labs, Palo Alto, he developed the technique for generating ultra-smooth metal surfaces for interfacing molecular electronic devices that dramatically helped improve the yield of molecular electronic device fabricated with self-assembled monolayers (SAMs). Recently, Dr. Islam demonstrated the world's first semiconductor nanowire bridging technique, which solves the longstanding issue of interfacing one-dimensional semiconductor nanodevices.
Dr. Islam is a faculty member of Electrical and Computer Engineering Department, University of California, Davis and is the principal investigator of the Integrated Nanodevices and Systems Research Program (i-nano) there. He has authored or co-authored more than 45 journal and conference papers and holds two patents with more than 30 pending patents as inventor/co-inventor. He served as the Conference Chair, Session Organizer of the Conferences sponsored by SPIE and MRS. He holds Ph.D. and M.S. degrees both in Electrical Engineering from University of California, Los Angels (UCLA). |
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| Rabi Sengupta |
| Rabi brings more than 12 years of design and management experience in signal integrity, high speed board, system, and IC industries and previously worked at Lightspeed Semiconductor and Actel with responsibility for development of high speed reference boards for FPGA. He has expertise in circuit design of both analog and digital, CAD methodology and chip interfaces for communication applications and also sensor design and their testing for bio-medical and industrial applications. At Banpil, Rabi is responsible for interconnect simulation, layout, prototype-buildup and testing and he is also involved in development of nano-sensor for numerous commercial and defense applications. Rabi obtained his MSEE degree from Columbia University. |
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