Expanding the Boundaries of Optics and
Electronics Technologies
High Speed Electrical Interconnects
Banpil Photonics is a world leading developer and licensor of fundamental technology expanding the boundaries of optics and electronics. Based in the heart of Silicon Valley, the company has developed an extensive IP portfolio of high-speed interconnects, multispectral image sensors, and high-efficiency photovoltaic technologies.

Banpil innovations enable the development and manufacture of new generations of unique low-cost, high-speed electrical and flexible circuit interconnects for chip-to-chip, chip-to-board, board-to-board, and rack-to-rack applications; multispectral image sensors for automotive & medical imaging, remote-sensing, and communication applications; and photovoltaic technology for solar cell applications.

Technology developed at Banpil is targeted for use in numerous market-focused applications of today as well as in next generation applications of tomorrow. Banpil is especially proud of being a truly “green” technology company where it matters most. Banpil interconnects reduce power consumption by as much as 90% compared to alternatives while Banpil photovoltaic technology is contributing in a significant way in the ultimate “green” by almost doubling the conversion efficiency.

Technologies and Applications

Banpil Announces Satori Group as Japan Distributor for Low-Power High-Speed Interconnect Products: Satori Electric Co., LTD to expand market access to leading Japanese system vendors and PCB manufacturers. Click here for Press Release

Banpil announces issuance of new patent for multispectral image sensor for next generation imaging applications:
Broadband sensor is capable of broad spectral range from near ultraviolet, visible, to short-wave infrared regions. Click here for Press Release

Banpil granted core patent for nano-enabled Hybrid Photovoltaic Device:
Device uses nanostructures to enable a new generation of significantly high-efficiency solar cells. Click here for Press Release

Banpil awarded more interconnect patents in 2011:
Interconnects patent portfolio exceeds twenty and ready to license to system vendors for next generation low-power and high-speed application development. Click here for Press Release

Banpil Announces Interconnect Simulation Tool S-Factor Software:
Standalone tools requires no EDA software, generates S-Parameters, available for free trial. Click here for Press Release. Request Banpil S-Factor Interconnects Simulation Tools CD.

Banpil announces issuance of core patent for nano-enabled electronic and photonic devices: Nanostructures enable innovations in highly sensitive multispectral sensors, energy harvesting, and high-efficiency solar cells technologies. Click here for Press Release

Banpil wins Frost & Sullivan award for technology innovation in image sensors. Click here for further details

Banpil's Advanced High-Speed Metallic Interconnects are featured in Frost and Sullivan's new research report "Global Advances in Electronic Chip Packaging." Contact us for further details.
  
Frost & Sullivan
covers Banpil's Nanosensor for Biomedical Applications and Banpil's Multispectral Sensors in its Technical Insights' Sensor Technology Alerts.
  
Banpil Announces Compatible Interconnect Library for Agilent's Advanced Design System EDA Software, Becomes Agilent Component Vendor Partner -- Banpil Library enables high-speed and low-power designs, is available for free download. Click here for Press Release
  
Download Banpil Interconnects Simulation Library for ADS

 
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