Expanding the Boundaries of Optics and
Electronics Technologies
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High Speed Electrical Interconnects
Banpil Photonics is expanding the boundaries of optics and electronics through innovations.

Banpil develops and manufactures next generation multispectral image sensors for automotive & medical imaging systems, security & surveillance, and machine vision applications; high-efficiency energy harvesting devices for energy applications; and low-power, high-speed electrical interconnects for chip-to-chip, chip-to-board, board-to-board, and rack-to-rack applications in high performance computing and networking.

Based in Santa Clara, CA at the heart of Silicon Valley, Banpil has developed an extensive IP portfolio of high-speed interconnects, multispectral image sensors, and high-efficiency photovoltaic technologies available for licensing, joint product development, and strategic manufacturing partnerships. For more information, please contact us.

Technologies and Applications

Banpil's Multispectral Image Sensors are featured in MarketsandMarkets new research report "Global Image Sensor Market (2013-2018)." Contact us for further details.
 
Banpil Announces Satori Group as Japan Distributor for Low-Power High-Speed Interconnect Products: Satori Electric Co., LTD to expand market access to leading Japanese system vendors and PCB manufacturers. Click here for Press Release

Banpil Announces Interconnect Simulation Tool S-Factor Software: Standalone tools requires no EDA software, generates S-Parameters, available for free trial. Click here for Press Release      Request Banpil S-Factor Interconnects Simulation Tools CD. 

Banpil wins Frost & Sullivan award for technology innovation in image sensors. Click here for further details

Banpil's Advanced High-Speed Metallic Interconnects are featured in Frost and Sullivan's new research report "Global Advances in Electronic Chip Packaging." Contact us for further details.

Frost & Sullivan covers Banpil's Nanosensor for Biomedical Applications and Banpil's Multispectral Sensors in its Technical Insights' Sensor Technology Alerts.
 
Banpil Announces Compatible Interconnect Library for Agilent's Advanced Design System EDA Software, Becomes Agilent Component Vendor Partner -- Banpil Library enables high-speed and low-power designs, is available for free download. Click here for Press Release
Banpil Achieves Milestone 48 Patents Awarded: Image Sensor, Energy Harvesting, Photovoltaic, and Interconnects patent portfolio available to license. Click here for Press Release

Banpil Granted Another Energy Harvesting Patent: Image Sensor, Photovoltaic, and Interconnects patent portfolio available to license. Click here for Press Release

Banpil Obtains Energy Harvesting Patent. Click here for Press Release

Banpil Issued Additional On-Chip Interconnects Patent: Interconnects patent portfolio including on-chip, chip-to-chip, electrical and optical interconnects technologies available to license. Click here for Press Release

Banpil Optical Interconnects Patent Awarded. Click here for Press Release

Banpil Granted Seven Solar Patents in 2014: Nano-enabled solar cell devices provide significant high-efficiency for energy applications. Click here for Press Release

Banpil's Multispectral Image Sensors are featured in MarketsandMarkets new research report "Global Smart Sensor Market (2013-2020)." Contact us for further details.
 
Banpil issued high-sensitivity nanosensor patent for biomolecule and chemical agent detection applications.
Click here for Press Release

 
Banpil awarded high-speed interconnects patent: Interconnects patent portfolio exceeds twenty five and ready to license to system vendors for next generation low-power and high-speed application development.
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Banpil announces MCT-SIMTM: high-performance Mercury Cadmium Telluride (MCT) device simulator software: Standalone tools eliminate cumbersome finite-element based methods, available for free trial. Click here for Press Release.Request Banpil MCT-SIMTM High-Performance Mercury Cadmium Telluride (MCT) Device Simulator CD.  
 
Banpil announces issuance of additional multispectral image sensor patent for broadband imaging applications. Click here for Press Release
 

 
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